波分复用器
1U DWDM密集波分复用器
Description
100GHz/200GHz DWDM Module in 1U Rackmount
F-tone Networks Optronics’ 100GHz/200 GHz dense wavelength division multiplexer (DWDM module) utilizes thin film coating technology and proprietary design of non-flux metal bonding micro optics packaging to achieve optical add and drop at the ITU wavelengths. It provides ITU channel center wavelength, low insertion loss, high channel isolation, wide pass band, low temperature sensitivity and epoxy free optical path . It can be used for wavelength add/drop in telecommunication network system./h4>
100GHz
200GHz
4 Channel
8 Channel
16 Channel
Mux
Demux
Bare fiber
900um loose tube
2mm Cable
3mm Cable
1m
2m
none
FC/APC
FC/PC
SC/APC
SC/PC
LC
ST
CH21
CH22
CH23
CH24
CH25
CH26
CH27
CH28
CH29
CH30
CH31
CH32
CH33
CH34
CH35
CH36
CH37
CH38
CH39
CH40
CH41
CH42
CH43
CH44
CH45
CH46
CH47
CH48
CH49
CH50
CH51
CH52
CH53
CH54
CH55
CH56
CH57
CH58
CH59
CH60
CH61
Features
Low Insertion Loss
Wide pass band
High channel
High stability and reliability
Epoxy free on optical path
Applications
Channel Add/Drop
DWDM Network
Wavelength Routing
Fiber Optical Amplifier
CATV Fiberoptic System
Performance Specifications
| Parameter | 4 Channel | 8 Channel | 16 Channel | ||||
| Mux | Demux | Mux | Demux | Mux | Demux | ||
| Channel Wavelength（nm） | ITU Grid | ||||||
| Channel Spacing (GHz) | 100 / 200 | ||||||
| Channel Passband (@-0.5dB bandwidth (nm) | >0.3 | ||||||
| Insertion Loss (dB) | ≤1.8 | ≤3.0 | ≤4.5 | ||||
| Channel Uniformity (dB) | ≤0.6 | ≤1.0 | ≤1.5 | ||||
| Channel Ripple (dB) | 0.3 | ||||||
| Isolation（dB） | Adjacent | N/A | >30 | N/A | >30 | N/A | >30 |
| Non-adjacent | N/A | >40 | N/A | >40 | N/A | >40 | |
| Inertion Loss Temperature Sensitivity (dB/℃) | <0.005 | ||||||
| Wavelength Temperature Shifting (nm/℃) | <0.002 | ||||||
| Polarization Dependent Loss (dB) | <0.1 | <0.1 | <0.15 | ||||
| Polarization Mode Dispersion（ps） | <0.1 | ||||||
| Directivity (dB) | ＞50 | ||||||
| Return Loss（dB） | ＞45 | ||||||
| Maximum Power Handling (mW) | 300 | ||||||
| Opterating Temperature (℃) | -5~+75 | ||||||
| Storage Temperature (℃) | -40~+85 | ||||||
| Package dimension (mm) | L432（482.6）xW250*H44 or Specify | ||||||
1、Above specifications are for devices without connector.
2、Specifications may change without notice.
{loadmodule mod_custom,Important Notice}
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